Semiconductor Equipment Corporation strives to be a leading designer and manufacturer of a wide range of manual and semiautomatic assembly, rework, handling, and test equipment used in the development and production of microelectronic devices for the photonics, semiconductor, hybrid and printed circuit industries.
Model 860 Eagle Omni Bonder
Product Overview
Semiconductor Equipment Corporation’s New Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation.
The Eagle’s base platform includes a retractable cube beam splitter viewing system with LED lighting, precision servo-driven Z motion with closed loop bond load control, closed loop temperature controls for head, stage and spot heating and Windows XP Pro operating system. Various standard heads and stages are available.
Features
Head Designs
- Precision servo-driven Z motion with bond load ranges of 10 grams to 10 kilograms controlled by closed loop system. Head die tools include flat face or collet design for specific applications. Head options include:
- Single Tool Head with bond loads to 10 KG and heating to 300 degrees C. Linear Scrub is an option.
- Dual Tool Head with pivoting die tool and preform tool with bond loads to 2 KG and heating to 250 degrees C. Allows preform and die placement in one cycle without tool switch-over. Pin transfer tool can also be used for adhesive. Linear Scrub is an option.
- Ultrasonic Head with loads to 3 KG.
- Pulsed Thermal Bond Head with loads to 10 KG and ramping of 100 degrees C per second to maximum of 450 degrees C.
Workstage Designs
- Micrometer adjusted workstage for alignment in X, Y and theta. Workchucks have vacuum hold-down or mechanical clamps. Custom workchucks available.
- ¾” Rapid Heat Cycle Workstage with quick heat up ramping to 450 degrees C and heated cover gas manifold with separate temperature control. Cooling gas manifold optional.
- 2” x 2” Heated Workstage with maximum temperature of 450 degrees C and heated cover gas manifold.
- 4” x 4” Heated Workstage with maximum temperature to 350 degrees C.
- 4” x 4” Unheated Workstage with aluminum workchuck.
Viewing System
- Retractable cube beam splitter vision system features a 12x zoom lens, digital camera, image capture, LED array lighting, electronic crosshair and a 17” LCD display.
- Direct View System option consists of stereo zoom microscope with 10X eyepieces, pivot mounting and ring light illumination. Allows operator to observe bonding process.
- Motorized Viewer option provides 5/8” travel from center in X and Y to facilitate alignment of large devices at high magnification.
Computer Control
- Computer with Windows XP operating system, CD drive, floppy drive, keyboard, mouse and 17” LCD display. Improved machine control software uses macros to set-up and save machine processes.
Options
For Flip Chip applications:
- Thermocompression bond head with temperatures up to 250 degrees C operation.
- Heated stage with closed loop temperature controls, operation up to 350 degrees C.
- Dual nozzle hot gas spot heating system for localized heating.
- Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.
For bonding edge emitting Laser Diodes:
- Rapid heat-up stage.
- Dual tool bond head consisting of one heated die tool and one preform tool.
- Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
- Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.
- Single nozzle hot gas heating system for localized heating.
Eutectic die bonding:
- Heated stage with closed loop temperature controls, operation up to 350 degrees C.
- Dual tool bond head consisting of one heated die tool and one preform tool.
- Dual nozzle hot gas spot heating system for localized heating.
- Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
Specifications:
Model 850 Flip Chip Placement System
Product Overview
Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.
An optional heated stage (Model 855) is available. An additional option, SEC´s Model 430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a spot heating source for airflow.
Color Video System
A motorized zoom lens allows the operator to optimize viewing with its standard range of 10x to 100x. Other ranges are available.
Fiber Optic Illuminators
The system has two separate fiber optic ring light illuminators with separate controls for each, one illuminating the die and the other illuminating the substrate.
Micrometer Adjusted Stage
A micrometer stage is used to adjust X, Y, and Theta to move the substrate into exact alignment with the die. A 4 " square vacuum chuck is provided.
Sliding Table with Brakes
The system has a sliding table which has a 5 " x 13 " travel. Table movement is controlled by a joystick. Pneumatic brakes lock the table in position.
SEC Model 430 Hot Gas Spot Heater (optional)
The Model 430 Hot Gas Jet Module uses heated gas to heat a single die to reflow. Its closed loop temperature control and gas flow control are integrated with the operation of the Model 850. This unit may be purchased as a field upgrade.
SEC Model 855 Heated Stage (optional)
The heated stage is capable of 250 º C operation. It incorporates a separate control box with its own closed loop temperature controls. This unit may be purchased as a field upgrade.
Fluxing Station (optional)
The system includes a fluxing tray to dip the die into flux or adhesive prior to placement. The fluxing station can be added as a field upgrade.
Illustrated Features:
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| A flux tray and doctor blade are used to apply a controlled and uniform thickness of flux. | Die are picked up from waffle packs. |
SEC’s Model 430 Hot Gas Jet Module deliver heated gas to the die in order to reflow a single die without affecting nearby components |
Features
- Manual X, Y sliding table with 13 " x 5 " of travel and ergonomic control arm.
- Micrometer adjusted X,Y and Theta stage for fine alignment.
- Pneumatic brakes for XY table movement.
- 4" square flat vacuum chuck.
- Cube beam splitter vision system with simultaneous view of die and substrate patterns for alignment.
- Motorized zoom lens, color camera and TV monitor.
- Four independent fiber optic ring light illuminators. Two for die and two for substrate illumination.
- Viewer automatically retracts when Z motion is activated.
- Automatic Z motion with pneumatic bond control panel adjusted.
- Pick up tool.
- Set up kit.
- Manual.
Options
- Pedestal with micrometer leveling.
- Removable flux tray.
- Hand held flux doctor blade.
- Hot gas jet which directs up to 800 º C heated gas through an interchangeable quartz to a specific area.
- Voltage proportioning temperature controller for closed loop control of the hot gas temperature.
- Adjustable gas flow with indicator.
- Round or rectangular nozzles are available in a variety of sizes. One standard .060 I.D. nozzle comes with the system.
- General purpose mounting bracket to facilitate mounting gas jet assembly to your equipment.
- Footswitch controlled.
- Three foot long interconnect cable between control module and gas jet assembly.
- Safety interlocked to prevent heater burnout.
- Manual.
Specification
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