Solder Paste Printer, Component/Chip Mounter, SRF Lead Free Reflow Ovens, PCB Handling Systems

Samsung Techwin has developed advanced technology for electronic & mechanical design, process, and production with high speed and accuracy, leveraging the technical expertise of developing and producing jet engines, industrial robots, semiconductor equipment, and opto-electronic machines.

Based on these technologies, we develop provide high-speed equipment, next generation equipment corresponding to package process, and multi-functional instruments with the highest reliability and productivity.

Keeping pace with the current trends of semiconductor package process, we provide chip mounters for assembling PCBs necessary for high performance electronic products and communication instruments with light weight, thin profiles, and small sizes. We also offer SMT total solution, as well as semiconductor assembly equipment including automatic ball bonders and beam lead bonders.

The main purpose of the web site is to provide information for you, the customers, not only those currently using our SMT/WB, but also those interested in Samsung’s SMT/WB. WE set up the efficient dialogue windows to offer information on new product and technology.

We are Committed to providing user-oriented equipment, concentrating on customer voices.

Chip Mounter

EXCEN

EXCEN

High Speed Modular Mounter

Realizes the World’s Highest Area Productivity
As a high speed modular mounter that applies a high speed rotary head equipped with 16 nozzles, EXCEN realizes the world’s highest speed of 120,000 CPH among mounters of the same class as well as the world’s highest area productivity. In addition, it secures the reliability of fine chip placement by applying the function to monitor pre- and post-part placement, SVS (Side-view Vision System), and maximizes work convenience and actual productivity by applying various operation modes including non-stop device type change,mixed production of different boards as well as the SMART Feeder that realizes the world’s first Auto Splicing and Auto Loading functions.

Features:

  • 120,000 CPH (Optimum)
  • Ultra Slim Design with a Total Length of 1.25m
  • Applies High Rotary Modular Head
  • Side-view Vision System(SVS)
    • Monitoring of pre- and post-part placement
  • Mixed Production of Different Boards/
  • Independent Production at the Front and Rear/
  • Non-stop Change-over of Device Types
  • High Speed and High Precision Feeder
  • SMART Feeder
    • The world’s first Auto Splicing and Auto Loading functions

Watch the video

The SM Series – A new generation component placement platform from Samsung Techwin :

  • Provides extraordinary speed, extreme precision, and advanced placement capabilities
  • Offers the ultimate solution in producing the next generation of mobile digital products
  • Achieve top performance with the highest speed and precision of Placers in their class
  • Realize unsurpassed efficiency with rapid changeover using the new SM Feeder System
  • Enhance productivity with a combination of the new Intelligent (IT) Feeder System and the Off Line Programming (OLP) Optimization Program

SM421 Advanced Flexible Mounter

SM421

Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly recognition.
It also allows recognition of parts with fine pitch such as □55mm with 0.4mm pitch by adopting a mega pixel vision system for the Stage camera.
It allows IC parts to be placed with high accuracy of 30 microns.
It also easily registers parts of complicated shape by supporting the polygon recognition algorithm.

Placement Speed

  • Chip 21K CPH (IPC9850)
  • QFP 6K CPH (IPC9850)

Applicable Parts

  • Max.0402(01005)~□55mm
  • (Part height H=15mm)

Placement Accuracy

  • Chip ±50㎛ (Cpk 1.0)
  • QFP ±30㎛ (Cpk 1.0)

Applicable PCBs

  • L460 x W400 x 1Lane(Standard)
  • Max. L740 x W460 x 1Lane

SM471 Flexible High Speed Chip Shooter

SM471As a high performance chip shooter that applies two gantries equipped with 10 spindles per head as well as new flying vision, the SM471 realizes a chip mounting speed of 75,000 CPH, the highest in the world among chip shooters of the same class. In addition, it is applicable to 0402 chips to the largest □ 14mm ICs by default and increases actual productivity and placement quality by applying an electrically driven high speed and high precision feeder. Moreover, it is designed for mixed use with the SM pneumatically driven feeder to maximize the customers’ operational convenience.

Placement Speed

  • 75,000 CPH(Optimum)
  • 2 Gantry x 10 Spindle/Head

Applicable Parts

0402 ~ □ 14mm(H 12mm) : IC, Connector (Lead Pitch 0.4mm), BGA, CSP (Ball Pitch 0.4mm)

Placement Accuracy

  • Chip ±50㎛@µ+3σ (Based on Standard Chips)

Applicable PCB

  • Max. 510(L) x 460(W)(Standard)
  • Max. 610(L) x 460(W)(Option)

Electrically Driven High Speed and High Precision Feeder

  • Allows mixed use with an SM pneumatically driven feeder

SMART Feeder

  • The world’s first feeder equipped

SM481 Advanced Flexible High Speed Chip Mounter

SM481As a general component placer whose vision system is reinforced based on the platform of the SM471 high speed chip shooter and whose chip placement speed is the highest among the same class component placers, the SM481 realized achip placement speed of 39,000 CPH, the highest among the same class component placers, by applying a head with one gantry and ten spindles as well as new flying vision and by maximizing the pickup and placement motion.

In addition, it is applicable up to 0402 chips and □42mm ICs. It has improved actual productivity and placement quality by applying high speed and high precision electrically driven feeders. Furthermore, since it is designed to be compatible with SM series pneumatic feeders, it maximizes the customer’s operational convenience.

Placement Speed

  • 39,000 CPH(Optimum)
  • 1 Gantry x 10 Spindles/Head

Applicable Part

  • 0402 ~ □42mm(H 15mm)

Placement Accuracy

  • Chip ±50㎛@µ+3σ
  • QFP ±30㎛@µ+3σ

Applicable PCB

  • 460(L) x 400(W)(Standard)
  • Max. 740(L) x 460(W)(Option)

High speed, high precision and electrically driven feeder

  • Automatic pick-up position alignment function
  • Compatible with SM pneumatic feeders

New vacuum system and optimized pickup/placement motion SMART Feeder

  • World’s first Auto Splicing and Auto Loading

Watch SM400 Series Video

Screen Printer

SP1 Compact High Performance Screen Printer

SP1 Features:

  • Alignment Accuracy : ±12.5μm@6σ
  • Print Cycle Time : 5seconds (Excluding printing time)
  • Applicable PCB (LxW) : 330mm x 250mm
  • Stencil Size (LxW) : 650mm x 550mm550mm x 650mm(Option)
  • Applicable for dual lane(bypass)
  • Mixed production(when using 2 machines)
  • SPI feedback function
  • Automatic mask changing/setting/leveling functions
  • Various operational conveniences

SMP200 Best Performance Screen Printer

SMP200 Features:

  • Cycle Time : Cycle Time 11.0 sec
  • Alignment Repeatability : ±25㎛@3σ
  • Applicable Stencil Size : Max. 736mm(L) × 736mm(W)
  • Applicable PCB Size : Max. 650mm(L) × 400mm(W)
  • Automatic Printing Pressure Control and Automatic
  • Leveling of Print Position(Option)

Reflower

Reflow Soldering System SRF70i Series

Next Generation Reflow

  • Provides a dual lane conveyor system for high speed mixed-model production(option)
  • Provides a real time temperature profile monitoring (RTPM) system(option)
  • Precision temperature control using the inverter and PC control method
  • Minimizes power and N2 consumption
SRF70i(side) SRF70i(main)

SRF 30/70 Series

Reflow Soldering System

  • Heating and cooling function applicable for the lead-free soldering of various boards
  • By increasing the number of heating zones and adopting reflow soldering system, the temperature profile with stable wind speed has been achieved.
  • All items are fully automatically controlled by PC.
  • Zones #6~#12 are multi-heating zones which can be varied according to specific purpose (refer to specifications).
  • Maintaining uniform nitrogen concentration atmosphere through all sections and optimize nitrogen consumption(N₂Type).
SRF30-70 SRF30-70(side)

 

PCB Handling System

Magazine Loader LD-300/500 Series

LD-300_500

Features:

  • Utilizes a side clamping process that avoids magazine distortion errors
  • Various board feeding pitches available: 1~4 steps (10, 20, 30, 40 mm)
  • Self diagnosis function via a 7 segment method
  • Compact and elegant design
  • Suitable for a variety of uses including SMT-line
  • Stable quality ensures improved productivity
  • Easy to operate

Options:

  • Time taken to change the magazine: 25 seconds
  • Buffer conveyor
  • Automatic conveyor width adjustment and pusher position adjustment functions
  • Touch panel
  • Dust removal by use of brush, ionizer or impinger

Magazine Unloader UL-300/500 Series

UL-300_500FEATURES

  • Utilizes a side clamping process that avoids magazine distortion errors
  • Various board feeding pitches available: 1~4 steps (10, 20, 30, 40mm)
  • Self diagnosis function via a 7 segment method
  • Compact and elegant design
  • Used in various ways for SMT-line, etc. according to the use
  • Stable quality ensures improved productivity
  • Easy to operate

Options:

  • Time taken to change the magazine: 25 seconds
  • Cooling fan integrated in pusher conveyor section
  • Automatic conveyor width adjustment and pusher position adjustment functions
  • Touch panel

Accessories

Work Table/Work Station WT-200/WS-200 Connection Conveyor CC-800

Work Table/Work Station WT-200/WS-200

Connection Conveyor

CC-800

For further information please go to SAMSUNG SMT Website.